5 Proposed concept

To support the demand in increasing peak and mobile data rate, 5G oriented systems are moving to higher frequencies. This trend requires semiconductor and packaging technologies being able to sustain:
- New architecture (beam wave forming)
- Compact RF transceiver compatible of the antenna mesh or system
- Specific design and integration intimately linked to the antenna panel
- Step up in integration to reduce RF losses at minima and improved performances
- Cost Reduction
- Mid to Mass market needs
- Flexibility and reconfiguration

These elements support the push a new strategy of integration. This is observed in many domains and market segments. It explains the participation in this project of key end users covering a large domain on the communication market.

This analysis supports the development of a technology platform having the capability to integrate different front end or Heteregenous technologies at Wafer Level. This approach has many advantages covering technical and business opportunities in Europe taking care of the industrial network requesting low to intermediate volume. The Concept proposed is “One Chip – One Front End RF” as shown in Fig. 5.1.

Fig. 5.1: Objective: One Chip – One Front RF with Heteregeous integration

No equivalent technology platform is already operating at industrial level in Europe and even in the World. We emphasize that this project plan to identify, develop all the R&D activities necessary to push technologies at the right level of readiness in line with this concept.